Computer simulation of thermal conditions of mould during the process of crystallization of black copper ingots

O. M. Ogorodnikova, D. G. Ryabov, V. S. Radya

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)89-93
Number of pages5
JournalЦветные металлы
Issue number5
Publication statusPublished - 2013

Keywords

  • Blister copper
  • Computer simulation
  • Finite-element method
  • Mould
  • Solidification
  • WinCAST

ASJC Scopus subject areas

  • Materials Chemistry
  • Metals and Alloys
  • Condensed Matter Physics
  • Physical and Theoretical Chemistry
  • Ceramics and Composites
  • Surfaces, Coatings and Films

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