Development of the regimes of semiautomatic contact soldering

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Article numberA031
Pages (from-to)282-284
Number of pages3
JournalJournal of Engineering Physics and Thermophysics
Volume88
Issue number1
DOIs
Publication statusPublished - 2015

Keywords

  • Contact soldering
  • Heat exchange
  • Multilayer printed circuit board
  • Solder
  • Temperature

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Engineering(all)

WoS ResearchAreas Categories

  • Thermodynamics

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