Evolution of the microstructure, electrical resistivity and microhardness during atomic ordering of cryogenically deformed Cu-47at.%Pd alloy

O. S. Novikova, E. G. Volkova, A. V. Glukhov, O. V. Antonova, A. E. Kostina, B. D. Antonov, A. Yu Volkov

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
Original languageEnglish
Article number155591
Number of pages10
JournalJournal of Alloys and Compounds
Volume838
DOIs
Publication statusPublished - 15 Oct 2020

Keywords

  • Cryogenic deformation
  • Cu-Pd alloys
  • Electrical resistivity
  • Order-disorder transformation
  • Solid state reactions
  • X-ray diffraction
  • PDCU
  • COPPER-PALLADIUM
  • DEFORMATION
  • PURE COPPER
  • RECOVERY
  • HYDROGEN SOLUBILITY
  • CU
  • SEPARATION

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

WoS ResearchAreas Categories

  • Chemistry, Physical
  • Materials Science, Multidisciplinary
  • Metallurgy & Metallurgical Engineering

Fingerprint

Dive into the research topics of 'Evolution of the microstructure, electrical resistivity and microhardness during atomic ordering of cryogenically deformed Cu-47at.%Pd alloy'. Together they form a unique fingerprint.

Cite this