Improvement of international standards for contact soldering in electronics

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)
Original languageEnglish
Pages (from-to)384-386
Number of pages3
JournalWelding International
Volume27
Issue number5
DOIs
Publication statusPublished - May 2013

Keywords

  • contact soldering
  • electronics
  • heat conductivity
  • solder
  • temperature
  • thermalcapacity
  • time

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys

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