Log pile measurement through 3D modeling

Artem Kruglov, Evgenia Shishko

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publication2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages263-266
Number of pages4
Volume2017-January
ISBN (Electronic)9781509039821
DOIs
Publication statusPublished - 19 Oct 2017
Event40th International Conference on Telecommunications and Signal Processing, TSP 2017 - Barcelona, Spain
Duration: 5 Jul 20177 Jul 2017

Conference

Conference40th International Conference on Telecommunications and Signal Processing, TSP 2017
CountrySpain
CityBarcelona
Period05/07/201707/07/2017

Fingerprint

Piles
Volume measurement
Photogrammetry
Timber
Measurement errors
Industry
Testing

Keywords

  • 3D modeling
  • Calibration
  • Photogrammetry
  • Spatial structure

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing

WoS ResearchAreas Categories

  • Computer Science, Theory & Methods
  • Engineering, Electrical & Electronic
  • Telecommunications

Cite this

Kruglov, A., & Shishko, E. (2017). Log pile measurement through 3D modeling. In 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017 (Vol. 2017-January, pp. 263-266). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TSP.2017.8075983
Kruglov, Artem ; Shishko, Evgenia. / Log pile measurement through 3D modeling. 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. pp. 263-266
@inproceedings{658fb1b866934b59b8c730e79cd9cc82,
title = "Log pile measurement through 3D modeling",
keywords = "3D modeling, Calibration, Photogrammetry, Spatial structure",
author = "Artem Kruglov and Evgenia Shishko",
year = "2017",
month = "10",
day = "19",
doi = "10.1109/TSP.2017.8075983",
language = "English",
volume = "2017-January",
pages = "263--266",
booktitle = "2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

Kruglov, A & Shishko, E 2017, Log pile measurement through 3D modeling. in 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 263-266, 40th International Conference on Telecommunications and Signal Processing, TSP 2017, Barcelona, Spain, 05/07/2017. https://doi.org/10.1109/TSP.2017.8075983

Log pile measurement through 3D modeling. / Kruglov, Artem; Shishko, Evgenia.

2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. p. 263-266.

Research output: Chapter in Book/Report/Conference proceedingConference contributionResearchpeer-review

TY - GEN

T1 - Log pile measurement through 3D modeling

AU - Kruglov, Artem

AU - Shishko, Evgenia

PY - 2017/10/19

Y1 - 2017/10/19

KW - 3D modeling

KW - Calibration

KW - Photogrammetry

KW - Spatial structure

UR - http://www.scopus.com/inward/record.url?scp=85042786920&partnerID=8YFLogxK

UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000425229000057

U2 - 10.1109/TSP.2017.8075983

DO - 10.1109/TSP.2017.8075983

M3 - Conference contribution

VL - 2017-January

SP - 263

EP - 266

BT - 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Kruglov A, Shishko E. Log pile measurement through 3D modeling. In 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Vol. 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. p. 263-266 https://doi.org/10.1109/TSP.2017.8075983