Optimization of the required temperature of contact soldering of electronic devices

Research output: Contribution to journalArticle

3 Citations (Scopus)
Original languageEnglish
Pages (from-to)1060-1065
Number of pages6
JournalJournal of Engineering Physics and Thermophysics
Volume86
Issue number5
DOIs
Publication statusPublished - Sep 2013

Keywords

  • devices
  • engineering physics
  • heat conduction
  • soldering
  • temperature
  • time

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Engineering(all)

WoS ResearchAreas Categories

  • Thermodynamics

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