The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)178-183
Number of pages6
JournalRussian Journal of Nondestructive Testing
Volume49
Issue number3
DOIs
Publication statusPublished - Mar 2013

Keywords

  • defect
  • quality
  • diagnostics
  • comparison
  • heat transfer
  • soldering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Condensed Matter Physics
  • Materials Science(all)

WoS ResearchAreas Categories

  • Materials Science, Characterization & Testing

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