To the issue of low-alloyed copper alloys for contact wires

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationMaterials Engineering and Technologies for Production and Processing VII
EditorsAndrey A. Radionov
PublisherTrans Tech Publications Ltd.
Pages179-184
Number of pages6
Volume410 DDF
ISBN (Print)9783035718409
DOIs
Publication statusPublished - 2021
Event7th International Conference on Industrial Engineering, ICIE 2021 - Virtual, Online
Duration: 17 May 202121 May 2021

Conference

Conference7th International Conference on Industrial Engineering, ICIE 2021
CityVirtual, Online
Period17/05/202121/05/2021

Keywords

  • Copper alloy
  • Electrical resistivity
  • Mechanical properties
  • Overhead contact wire
  • Recrystallization temperature

ASJC Scopus subject areas

  • Radiation
  • Materials Science(all)
  • Condensed Matter Physics

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