Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing

P. P. Pal-Val, Yu. N. Loginov, S. L. Demakov, A. G. Illarionov, V. D. Natsik, L. N. Pal-Val, A. A. Davydenko, A. P. Rybalko

Research output: Contribution to journalArticleResearchpeer-review

11 Citations (Scopus)
Original languageEnglish
Pages (from-to)9-15
Number of pages7
JournalMaterials science and engineering a-Structural materials properties microstructure and processing
Volume618
DOIs
Publication statusPublished - 17 Nov 2014

Keywords

  • Elastic properties
  • Young's modulus
  • Severe plastic deformation
  • Crystallographic texture
  • Annealing
  • SEVERE PLASTIC-DEFORMATION
  • LOW-TEMPERATURE

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Condensed Matter Physics
  • Materials Science(all)

Cite this

@article{1635c3a6ce0746b48e52a15cdd54bee6,
title = "Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing",
keywords = "Elastic properties, Young's modulus, Severe plastic deformation, Crystallographic texture, Annealing, SEVERE PLASTIC-DEFORMATION, LOW-TEMPERATURE",
author = "Pal-Val, {P. P.} and Loginov, {Yu. N.} and Demakov, {S. L.} and Illarionov, {A. G.} and Natsik, {V. D.} and Pal-Val, {L. N.} and Davydenko, {A. A.} and Rybalko, {A. P.}",
year = "2014",
month = "11",
day = "17",
doi = "10.1016/j.msea.2014.08.069",
language = "English",
volume = "618",
pages = "9--15",
journal = "Materials science and engineering a-Structural materials properties microstructure and processing",
issn = "0921-5093",
publisher = "Elsevier BV",

}

Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing. / Pal-Val, P. P.; Loginov, Yu. N.; Demakov, S. L.; Illarionov, A. G.; Natsik, V. D.; Pal-Val, L. N.; Davydenko, A. A.; Rybalko, A. P.

In: Materials science and engineering a-Structural materials properties microstructure and processing, Vol. 618, 17.11.2014, p. 9-15.

Research output: Contribution to journalArticleResearchpeer-review

TY - JOUR

T1 - Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing

AU - Pal-Val, P. P.

AU - Loginov, Yu. N.

AU - Demakov, S. L.

AU - Illarionov, A. G.

AU - Natsik, V. D.

AU - Pal-Val, L. N.

AU - Davydenko, A. A.

AU - Rybalko, A. P.

PY - 2014/11/17

Y1 - 2014/11/17

KW - Elastic properties

KW - Young's modulus

KW - Severe plastic deformation

KW - Crystallographic texture

KW - Annealing

KW - SEVERE PLASTIC-DEFORMATION

KW - LOW-TEMPERATURE

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U2 - 10.1016/j.msea.2014.08.069

DO - 10.1016/j.msea.2014.08.069

M3 - Article

VL - 618

SP - 9

EP - 15

JO - Materials science and engineering a-Structural materials properties microstructure and processing

JF - Materials science and engineering a-Structural materials properties microstructure and processing

SN - 0921-5093

ER -