Технические дисциплины и материаловедение
Electronic structure
100%
Intercalation compounds
76%
Crystal structure
70%
Intercalation
54%
Synchrotron radiation
52%
Atoms
50%
Magnetic properties
44%
Fermi level
42%
Energy gap
41%
Fermi surface
41%
X ray photoelectron spectroscopy
37%
Copper
29%
Electromotive force
23%
Atomic force microscopy
23%
Metal insulator transition
23%
Interfacial energy
22%
Conduction bands
20%
Covalent bonds
20%
Selenium
19%
Phase transitions
19%
Transition metals
18%
Hot Temperature
17%
Charge transfer
15%
Temperature
14%
Single crystals
14%
Heating
13%
DOS
12%
Semiconductor materials
10%
Химические соединения
Intercalation Compound
95%
Electronic State
67%
Electromotive Force
47%
Phase Stability
44%
Fermi Level
42%
Surface Free Energy
42%
Synchrotron Radiation
39%
Crystal Structure
36%
Disorder
31%
Metal-Semiconductor Transition
29%
Magnetic Property
29%
Atomic Force Microscopy
29%
Annealing
28%
Band Gap
27%
Metal Insulator Transition
26%
X-Ray Photoelectron Spectroscopy
25%
Selenium Atom
25%
Thermal Stability
24%
Conduction Band
19%
Density of State
19%
Covalent Bond
18%
X-Ray Diffraction
18%
Monoclinic Space Group
13%
Single Crystalline Solid
13%
Charge Transfer
12%
Физика и астрономия
intercalation
83%
electronic structure
50%
ratings
44%
self assembly
38%
sublattices
36%
resources
36%
education
36%
fragments
31%
selenium
30%
crystal structure
28%
copper
26%
magnetic properties
25%
atoms
24%
optimization
24%
games
22%
Russian Federation
22%
genes
21%
Janus
20%
Fermi surfaces
19%
electromotive forces
15%
covalent bonds
15%
sulfur
14%
surface energy
11%
synchrotron radiation
10%
charge transfer
10%
conduction bands
10%
transition metals
10%
photoelectron spectroscopy
10%
electrochemical cells
9%
atomic force microscopy
9%
insulators
9%
single crystals
7%
shift
7%
cells
6%
metals
6%
solid solutions
6%
x rays
5%
symmetry
5%
