The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Resultado de la investigación: Articlerevisión exhaustiva

1 Cita (Scopus)
Idioma originalEnglish
Páginas (desde-hasta)178-183
Número de páginas6
PublicaciónRussian Journal of Nondestructive Testing
Volumen49
N.º3
DOI
EstadoPublished - mar 2013

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Condensed Matter Physics
  • Materials Science(all)

WoS ResearchAreas Categories

  • Materials Science, Characterization & Testing

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