@inproceedings{3be87b57d4b54116874f1d3574eec09e,
title = "Copper recovery from rinse waters after ammoniac etching of printed circuit boards",
keywords = "Ammonia, Copper, Ion exchange, Printed circuit boards, Rinse waters",
author = "Makovskaya, {O. Yu} and A. Shevchuk and Sorokinc, {S. P.}",
year = "2020",
month = jan,
day = "1",
doi = "10.4028/www.scientific.net/SSP.299.998",
language = "English",
isbn = "9783035715002",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd.",
pages = "998--1004",
editor = "Radionov, {Andrey A.}",
booktitle = "Materials Engineering and Technologies for Production and Processing V",
address = "Switzerland",
note = "5th International Conference on Industrial Engineering,ICIE 2019 ; Conference date: 25-03-2019 Through 29-03-2019",
}