Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses

Результат исследований: Глава в книге, отчете, сборнике статейМатериалы конференцииНаучно-исследовательскаярецензирование

Язык оригиналаАнглийский
Название основной публикацииProceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018
ИздательInstitute of Electrical and Electronics Engineers Inc.
ISBN (электронное издание)9781538657102
DOI
СостояниеОпубликовано - 5 ноя 2018
Событие2018 IEEE East-West Design and Test Symposium, EWDTS 2018 - Kazan, Российская Федерация
Продолжительность: 14 сен 201817 сен 2018

Конференция

Конференция2018 IEEE East-West Design and Test Symposium, EWDTS 2018
СтранаРоссийская Федерация
ГородKazan
Период14/09/201817/09/2018

Отпечаток

Coupler
couplers
Substrate
miniaturization
Substrates
Equivalent Circuit
Line
dividers
high resistance
Capacitance
Container
containers
equivalent circuits
Equivalent circuits
Frequency bands
Containers
Branch
capacitance
Networks (circuits)

Предметные области ASJC Scopus

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Control and Optimization
  • Instrumentation

Цитировать

Letavin, D. A. (2018). Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. В Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018 [8524782] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EWDTS.2018.8524782
Letavin, Denis A. / Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018. Institute of Electrical and Electronics Engineers Inc., 2018.
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Letavin, DA 2018, Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. в Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018., 8524782, Institute of Electrical and Electronics Engineers Inc., 2018 IEEE East-West Design and Test Symposium, EWDTS 2018, Kazan, Российская Федерация, 14/09/2018. https://doi.org/10.1109/EWDTS.2018.8524782

Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. / Letavin, Denis A.

Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018. Institute of Electrical and Electronics Engineers Inc., 2018. 8524782.

Результат исследований: Глава в книге, отчете, сборнике статейМатериалы конференцииНаучно-исследовательскаярецензирование

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Letavin DA. Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. В Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018. Institute of Electrical and Electronics Engineers Inc. 2018. 8524782 https://doi.org/10.1109/EWDTS.2018.8524782