| Язык оригинала | Английский |
|---|---|
| Название основной публикации | Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018 |
| Издатель | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (электронное издание) | 9781538657102 |
| DOI | |
| Состояние | Опубликовано - 5 ноя 2018 |
| Событие | 2018 IEEE East-West Design and Test Symposium, EWDTS 2018 - Kazan, Российская Федерация Продолжительность: 14 сен 2018 → 17 сен 2018 |
Конференция
| Конференция | 2018 IEEE East-West Design and Test Symposium, EWDTS 2018 |
|---|---|
| Страна | Российская Федерация |
| Город | Kazan |
| Период | 14/09/2018 → 17/09/2018 |
Отпечаток
Coupler
couplers
Substrate
miniaturization
Substrates
Equivalent Circuit
Line
dividers
high resistance
Capacitance
Container
containers
equivalent circuits
Equivalent circuits
Frequency bands
Containers
Branch
capacitance
Networks (circuits)
Предметные области ASJC Scopus
- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality
- Control and Optimization
- Instrumentation
Цитировать
Letavin, D. A. (2018). Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. В Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018 [8524782] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EWDTS.2018.8524782
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title = "Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses",
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year = "2018",
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language = "English",
booktitle = "Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
}
Letavin, DA 2018, Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. в Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018., 8524782, Institute of Electrical and Electronics Engineers Inc., 2018 IEEE East-West Design and Test Symposium, EWDTS 2018, Kazan, Российская Федерация, 14/09/2018. https://doi.org/10.1109/EWDTS.2018.8524782
Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. / Letavin, Denis A.
Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018. Institute of Electrical and Electronics Engineers Inc., 2018. 8524782.Результат исследований: Глава в книге, отчете, сборнике статей › Материалы конференции › Научно-исследовательская › рецензирование
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Letavin DA. Development of Compact Coupler Devices on Microstrip Structures with Different Substrate Thicknesses. В Proceedings of 2018 IEEE East-West Design and Test Symposium, EWDTS 2018. Institute of Electrical and Electronics Engineers Inc. 2018. 8524782 https://doi.org/10.1109/EWDTS.2018.8524782