ЯзыкАнглийский
Страницы1164-1172
Число страниц9
ЖурналJournal of Alloys and Compounds
Том770
DOI
СостояниеОпубликовано - 5 янв 2019

Отпечаток

Entropy
Thermal conductivity
Crystalline materials
Microstructure
Composite structures
Zirconium
Copper
Magnetic properties
Electric properties
Thermodynamic properties
Solubility
Scattering
Glass
Temperature
Ultrafine

Ключевые слова

    Предметные области ASJC Scopus

    • Mechanics of Materials
    • Mechanical Engineering
    • Metals and Alloys
    • Materials Chemistry

    Предметные области WoS

    • Химия, Физическая
    • Материаловедение, Многопрофильные области
    • Металлургия и Металловедение

    Цитировать

    @article{6a789ad7bb2449bf8ddc790a43efb8ed,
    title = "Electronic transport in equiatomic CuZrNiTi alloy",
    keywords = "Electrical conductivity, Electron microscopy, Electronic transport properties, Heat capacity, High-entropy alloys, Structure, Thermal expansion, SYSTEM, FORMING ABILITY, TEMPERATURE-DEPENDENCE, BEHAVIOR, THERMAL-CONDUCTIVITY, MECHANICAL-PROPERTIES, ELECTRICAL-RESISTIVITY, SUPERCOOLED LIQUID REGION, CU-ZR BINARY, BULK METALLIC-GLASS",
    author = "S. Uporov and V. Bykov and S. Estemirova and S. Melchakov and R. Ryltsev",
    year = "2019",
    month = "1",
    day = "5",
    doi = "10.1016/j.jallcom.2018.08.225",
    language = "English",
    volume = "770",
    pages = "1164--1172",
    journal = "Journal of Alloys and Compounds",
    issn = "0925-8388",
    publisher = "Elsevier Inc.",

    }

    Electronic transport in equiatomic CuZrNiTi alloy. / Uporov, S.; Bykov, V.; Estemirova, S.; Melchakov, S.; Ryltsev, R.

    В: Journal of Alloys and Compounds, Том 770, 05.01.2019, стр. 1164-1172.

    Результат исследований: Вклад в журналСтатьяНаучно-исследовательскаярецензирование

    TY - JOUR

    T1 - Electronic transport in equiatomic CuZrNiTi alloy

    AU - Uporov, S.

    AU - Bykov, V.

    AU - Estemirova, S.

    AU - Melchakov, S.

    AU - Ryltsev, R.

    PY - 2019/1/5

    Y1 - 2019/1/5

    KW - Electrical conductivity

    KW - Electron microscopy

    KW - Electronic transport properties

    KW - Heat capacity

    KW - High-entropy alloys

    KW - Structure

    KW - Thermal expansion

    KW - SYSTEM

    KW - FORMING ABILITY

    KW - TEMPERATURE-DEPENDENCE

    KW - BEHAVIOR

    KW - THERMAL-CONDUCTIVITY

    KW - MECHANICAL-PROPERTIES

    KW - ELECTRICAL-RESISTIVITY

    KW - SUPERCOOLED LIQUID REGION

    KW - CU-ZR BINARY

    KW - BULK METALLIC-GLASS

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    UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000449486300137

    U2 - 10.1016/j.jallcom.2018.08.225

    DO - 10.1016/j.jallcom.2018.08.225

    M3 - Article

    VL - 770

    SP - 1164

    EP - 1172

    JO - Journal of Alloys and Compounds

    T2 - Journal of Alloys and Compounds

    JF - Journal of Alloys and Compounds

    SN - 0925-8388

    ER -