Log pile measurement through 3D modeling

Artem Kruglov, Evgenia Shishko

Результат исследований: Глава в книге, отчете, сборнике статейМатериалы конференцииНаучно-исследовательскаярецензирование

1 цитирование (Scopus)
Язык оригиналаАнглийский
Название основной публикации2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017
ИздательInstitute of Electrical and Electronics Engineers Inc.
Страницы263-266
Число страниц4
Том2017-January
ISBN (электронное издание)9781509039821
DOI
СостояниеОпубликовано - 19 окт 2017
Событие40th International Conference on Telecommunications and Signal Processing, TSP 2017 - Barcelona, Испания
Продолжительность: 5 июл 20177 июл 2017

Конференция

Конференция40th International Conference on Telecommunications and Signal Processing, TSP 2017
СтранаИспания
ГородBarcelona
Период05/07/201707/07/2017

Отпечаток

Piles
Volume measurement
Photogrammetry
Timber
Measurement errors
Industry
Testing

Ключевые слова

    Предметные области ASJC Scopus

    • Computer Networks and Communications
    • Signal Processing

    Предметные области WoS

    • Компьютерные науки, Теория и методы
    • Технологии, Электро и электронные
    • Телекоммуникации

    Цитировать

    Kruglov, A., & Shishko, E. (2017). Log pile measurement through 3D modeling. В 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017 (Том 2017-January, стр. 263-266). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TSP.2017.8075983
    Kruglov, Artem ; Shishko, Evgenia. / Log pile measurement through 3D modeling. 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Том 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. стр. 263-266
    @inproceedings{658fb1b866934b59b8c730e79cd9cc82,
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    author = "Artem Kruglov and Evgenia Shishko",
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    Kruglov, A & Shishko, E 2017, Log pile measurement through 3D modeling. в 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. том. 2017-January, Institute of Electrical and Electronics Engineers Inc., стр. 263-266, 40th International Conference on Telecommunications and Signal Processing, TSP 2017, Barcelona, Испания, 05/07/2017. https://doi.org/10.1109/TSP.2017.8075983

    Log pile measurement through 3D modeling. / Kruglov, Artem; Shishko, Evgenia.

    2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Том 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. стр. 263-266.

    Результат исследований: Глава в книге, отчете, сборнике статейМатериалы конференцииНаучно-исследовательскаярецензирование

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    Kruglov A, Shishko E. Log pile measurement through 3D modeling. В 2017 40th International Conference on Telecommunications and Signal Processing, TSP 2017. Том 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. стр. 263-266 https://doi.org/10.1109/TSP.2017.8075983