Miniaturization as a way to preserve material in the manufacture of microstrip devices

Результат исследований: Вклад в журналМатериалы конференцииНаучно-исследовательскаярецензирование

Язык оригиналаАнглийский
Страницы (с-по)287-292
Число страниц6
ЖурналInternational Multidisciplinary Scientific GeoConference Surveying Geology and Mining Ecology Management, SGEM
Том18
Номер выпуска6.1
DOI
СостояниеОпубликовано - 1 янв 2018
Событие18th International Multidisciplinary Scientific Geoconference, SGEM 2018 - Albena, Болгария
Продолжительность: 2 июл 20188 июл 2018

Отпечаток

Microstrip devices
etching
Etching
coating
manufacturing
radio
Milling cutters
copper
Copper
substrate
Coatings
Milling machines
electrodynamics
Milling (machining)
Electrodynamics
Mica
Substrates
mica
ceramics
glass

Ключевые слова

    Предметные области ASJC Scopus

    • Geotechnical Engineering and Engineering Geology
    • Geology

    Цитировать

    @article{38574f4e026a4d6288da3e6bb9cbf95b,
    title = "Miniaturization as a way to preserve material in the manufacture of microstrip devices",
    keywords = "Dielectric, Material, Microstrip line, Miniaturization, Substrate",
    author = "Letavin, {Denis A.} and Knyazev, {Nikolay S.}",
    year = "2018",
    month = "1",
    day = "1",
    doi = "10.5593/sgem2018/6.1/S24.039",
    language = "English",
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    pages = "287--292",
    journal = "International Multidisciplinary Scientific GeoConference Surveying Geology and Mining Ecology Management, SGEM",
    issn = "1314-2704",
    publisher = "International Multidisciplinary Scientific Geoconference",
    number = "6.1",

    }

    Miniaturization as a way to preserve material in the manufacture of microstrip devices. / Letavin, Denis A.; Knyazev, Nikolay S.

    В: International Multidisciplinary Scientific GeoConference Surveying Geology and Mining Ecology Management, SGEM, Том 18, № 6.1, 01.01.2018, стр. 287-292.

    Результат исследований: Вклад в журналМатериалы конференцииНаучно-исследовательскаярецензирование

    TY - JOUR

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    AU - Letavin, Denis A.

    AU - Knyazev, Nikolay S.

    PY - 2018/1/1

    Y1 - 2018/1/1

    KW - Dielectric

    KW - Material

    KW - Microstrip line

    KW - Miniaturization

    KW - Substrate

    UR - http://www.scopus.com/inward/record.url?scp=85058876391&partnerID=8YFLogxK

    U2 - 10.5593/sgem2018/6.1/S24.039

    DO - 10.5593/sgem2018/6.1/S24.039

    M3 - Conference article

    VL - 18

    SP - 287

    EP - 292

    JO - International Multidisciplinary Scientific GeoConference Surveying Geology and Mining Ecology Management, SGEM

    JF - International Multidisciplinary Scientific GeoConference Surveying Geology and Mining Ecology Management, SGEM

    SN - 1314-2704

    IS - 6.1

    ER -