Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing

P. P. Pal-Val, Yu. N. Loginov, S. L. Demakov, A. G. Illarionov, V. D. Natsik, L. N. Pal-Val, A. A. Davydenko, A. P. Rybalko

Результат исследований: Вклад в журналСтатьяНаучно-исследовательскаярецензирование

11 Цитирования (Scopus)
Язык оригиналаАнглийский
Страницы (с-по)9-15
Число страниц7
ЖурналMaterials science and engineering a-Structural materials properties microstructure and processing
Том618
DOI
СостояниеОпубликовано - 17 ноя 2014

Ключевые слова

    Предметные области ASJC Scopus

    • Mechanical Engineering
    • Mechanics of Materials
    • Condensed Matter Physics
    • Materials Science(all)

    Цитировать

    @article{1635c3a6ce0746b48e52a15cdd54bee6,
    title = "Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing",
    keywords = "Elastic properties, Young's modulus, Severe plastic deformation, Crystallographic texture, Annealing, SEVERE PLASTIC-DEFORMATION, LOW-TEMPERATURE",
    author = "Pal-Val, {P. P.} and Loginov, {Yu. N.} and Demakov, {S. L.} and Illarionov, {A. G.} and Natsik, {V. D.} and Pal-Val, {L. N.} and Davydenko, {A. A.} and Rybalko, {A. P.}",
    year = "2014",
    month = "11",
    day = "17",
    doi = "10.1016/j.msea.2014.08.069",
    language = "English",
    volume = "618",
    pages = "9--15",
    journal = "Materials science and engineering a-Structural materials properties microstructure and processing",
    issn = "0921-5093",
    publisher = "Elsevier BV",

    }

    Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing. / Pal-Val, P. P.; Loginov, Yu. N.; Demakov, S. L.; Illarionov, A. G.; Natsik, V. D.; Pal-Val, L. N.; Davydenko, A. A.; Rybalko, A. P.

    В: Materials science and engineering a-Structural materials properties microstructure and processing, Том 618, 17.11.2014, стр. 9-15.

    Результат исследований: Вклад в журналСтатьяНаучно-исследовательскаярецензирование

    TY - JOUR

    T1 - Unusual Young's modulus behavior in ultrafine-grained and microcrystalline copper wires caused by texture changes during processing and annealing

    AU - Pal-Val, P. P.

    AU - Loginov, Yu. N.

    AU - Demakov, S. L.

    AU - Illarionov, A. G.

    AU - Natsik, V. D.

    AU - Pal-Val, L. N.

    AU - Davydenko, A. A.

    AU - Rybalko, A. P.

    PY - 2014/11/17

    Y1 - 2014/11/17

    KW - Elastic properties

    KW - Young's modulus

    KW - Severe plastic deformation

    KW - Crystallographic texture

    KW - Annealing

    KW - SEVERE PLASTIC-DEFORMATION

    KW - LOW-TEMPERATURE

    UR - http://www.scopus.com/inward/record.url?scp=84907484504&partnerID=8YFLogxK

    UR - https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=tsmetrics&SrcApp=tsm_test&DestApp=WOS_CPL&DestLinkType=FullRecord&KeyUT=000344439500002

    U2 - 10.1016/j.msea.2014.08.069

    DO - 10.1016/j.msea.2014.08.069

    M3 - Article

    VL - 618

    SP - 9

    EP - 15

    JO - Materials science and engineering a-Structural materials properties microstructure and processing

    JF - Materials science and engineering a-Structural materials properties microstructure and processing

    SN - 0921-5093

    ER -