Способ подготовки поверхности полиимида под химическую металлизацию: патент на изобретение

科研成果: Patent

摘要

FIELD: manufacturing technology. SUBSTANCE: invention relates to methods for production of flexible printed circuit boards, connection cables, trains, microcircuits. Method for preparation of polyimide surface for chemical deposition of copper coating is disclosed, which involves polyimide etching with aqueous solution of alkali, containing 150–250 g/l of NaOH or KOH, at temperature of 60±2 °C during 5–15 minutes with subsequent activation with water solutions of silver nitrate of composition 3–5 g/l for 10–15 minutes at room temperature.
EFFECT: proposed technology of chemical application of conductive coating is easier, more efficient and chemically and environmentally safer than known level of equipment.
投稿的翻译标题METHOD FOR PREPARATION OF POLYIMIDE SURFACE FOR CHEMICAL METAL COATING: patent of invention
源语言Russian
专利号2607627
IPCC23C 18/38,H05K 3/18
归档日期27/07/2015
Published - 10 一月 2017

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