Copper recovery from rinse waters after ammoniac etching of printed circuit boards

O. Yu Makovskaya, A. Shevchuk, S. P. Sorokinc

科研成果: Conference contribution同行评审

1 引用 (Scopus)
源语言English
主期刊名Materials Engineering and Technologies for Production and Processing V
编辑Andrey A. Radionov
出版商Trans Tech Publications Ltd.
998-1004
页数7
ISBN(印刷版)9783035715002
DOI
Published - 1 一月 2020
活动5th International Conference on Industrial Engineering,ICIE 2019 - Sochi, Russian Federation
期限: 25 三月 201929 三月 2019

出版系列

姓名Solid State Phenomena
299 SSP
ISSN(电子版)1662-9779

Conference

Conference5th International Conference on Industrial Engineering,ICIE 2019
国家/地区Russian Federation
Sochi
时期25/03/201929/03/2019

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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